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Bake Oven |
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This is to bake or materials such as Leadframe and PCB. (Semiconductor Device, Substrate, Glass, etc) Besides, it is applied for Epoxy hardening. Special and customized oven can be provided |
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Specification |
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In size : 580W x 580D x 580H(mm)~1000 x 900 x 1300(Customized size manufacturing) |
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Operate : Programmable Operation |
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Controller : 16 Step & Pattern |
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Vacuum Chamber |
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| This is to remove moisture and epoxy, also applied to remove bubble after coating. |
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Specification |
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In size : 580 x 580 x 580 ~1000 x 900 x 1000(Customized size manufacturing) |
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Temp. range : 40 ℃ ~240 ℃ / 40 minutes |
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Temperature Accuracy : ± 2.5% |
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100 Class ~ 1000 Class |
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Vacuum Range : 760mmHg ~0.1mmHg |
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